1 motorola smallsignal transistors, fets and diodes device data
part of the greenline ? portfolio of devices with energyconserving traits. this pnp silicon epitaxial planar transistor is designed to conserve energy in general purpose driver applications. this device is housed in the sot -23 and sc59 p ackage s w hic h a r e d esigne d f o r l o w p owe r s urfac e m ount applications. ? low v ce(sat) , < 0.1 v at 50 ma applications ? lcd backlight driver ? annunciator driver ? general output device driver maximum ratings (t a = 25 c) rating symbol value unit collector-base voltage v (br)cbo 45 vdc collector-emitter voltage v (br)ceo 15 vdc emitter-base voltage v (br)ebo 5.0 vdc collector current e continuous i c 100 madc device marking mmbt1010lt1 = glp MSD1010T1 = glp thermal characteristics rating symbol max unit power dissipation t a = 25 c derate above 25 c p d (1) 225 1.8 mw mw/ c thermal resistance junction to ambient r q ja 556 c/w junction temperature t j 150 c storage temperature range t stg 55 ~ + 150 c electrical characteristics characteristic symbol condition min max unit collector-emitter breakdown voltage v (br)ceo i c = 10 ma, i b = 0 15 e vdc emitter-base breakdown voltage v (br)ebo i e = 10 m a, i e = 0 5.0 e vdc collector-base cutoff current i cbo v cb = 20 v, i e = 0 e 0.1 m a collector-emitter cutoff current i ceo v ce = 10 v, i b = 0 e 100 m a dc current gain h fe1 (2) v ce = 5 v, i c = 100 ma 300 600 e collector-emitter saturation voltage v ce(sat) (2) i c = 10 ma, i b = 1.0 ma i c = 50 ma, i b = 5.0 ma i c = 100 ma, i b = 10 ma e e 0.1 0.1 0.19 vdc base-emitter saturation voltage v be(sat) (2) i c = 100 ma, i b = 10 ma e 1.1 vdc (1) device mounted on a fr-4 glass epoxy printed circuit board using the minimum recommended footprint. (2) pulse test: pulse width 300 m s, d.c. 2%. greenline is a trademark of motorola, inc. thermal clad is a registered trademark of the berquist company . preferred devices are motorola recommended choices for future use and best overall value. rev 1 order this document by mmbt1010lt1/d
semiconductor technical data
pnp general purpose driver transistors surface mount case 31807, style 6 sot-23 motorola preferred devices collector base emitter case 318d03, style 1 sc-59 mmbt1010lt1 MSD1010T1 ? motorola, inc. 1995 ? free datasheet http:///
2 motorola smallsignal transistors, fets and diodes device data minimum recommended footprint for surface mounted applications surface mount board layout is a critical portion of the total design. the footprint for the semiconductor packages must be t h e c orrec t s iz e t o i nsur e p rope r s older c onnection interfac e b etwee n t he b oard a n d t h e p ackage . w it h t he correct p a d g eometry , t h e p ackage s w il l s el f a lig n w hen subjected to a solder reflow process. mm inches 2.5-3.0 0.039 1.0 0.094 0.8 0.098-0.118 2.4 0.031 0.95 0.037 0.95 0.037 sot23 mm inches 0.037 0.95 0.037 0.95 0.079 2.0 0.035 0.9 0.031 0.8 sc59 sc-59/sot-23 power dissipation the power dissipation of the sc-59/sot -23 is a function of the drain pad size. this can vary from the minimum pad size for s olderin g t o t h e p a d s iz e g ive n f o r m aximu m p ower dissipation. power dissipation for a surface mount device is determined by t j(max) , the maximum rated junction tempera - ture of the die, r q ja , the thermal resistance from the device junction t o a mbient ; a n d t h e o peratin g t emperature , t a . usin g t he v alue s p rovide d o n t h e d at a s heet , p d c a n b e calculated as follows. p d = t j(max) t a r q ja the v alue s f o r t h e e quatio n a r e f oun d i n t h e m aximum ratings table on the data sheet. substituting these values into the equation for an ambient temperature t a of 25 c, one can calculate the power dissipation of the device which in this case is 225 milliwatts. p d = 150 c 25 c 556 c/w = 225 milliwatts the 5 56 c/ w a ssume s t h e u s e o f t h e r ecommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. another alternative would be to use a ceramic substrate or an aluminum core board such a s t herma l c lad ? . u sin g a b oar d m ateria l s uc h a s thermal clad, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher than the rated temperature of the device. when the entire device is heated to a high temperature, failure to complete soldering within a short t im e c oul d r esul t i n d evic e f ailure . t herefore , t he following i tem s s houl d a lway s b e o bserved i n o rde r t o minimize t h e t herma l s tres s t o w hic h t h e d evice s a re subjected. ? always preheat the device. ? the delta temperature between the preheat and soldering should be 100 c or less.* ? when preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. when using infrared heating with the reflow soldering method, the difference should be a maximum of 10 c. ? the soldering temperature and time should not exceed 260 c for more than 10 seconds. ? when shifting from preheating to soldering, the maximum temperature gradient should be 5 c or less. ? after soldering has been completed, the device should be allowed to cool naturally for at least three minutes. gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. ? mechanical stress or shock should not be applied during cooling * soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. free datasheet http:///
3 motorola smallsignal transistors, fets and diodes device data solder stencil guidelines prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. a solder stencil is required to screen the optimum amount of solder paste onto the footprint. the stencil is made of brass or stainless steel with a typical thickness of 0.008 inches. the stencil opening size for the surface mounted package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration. typical solder heating profile for any given circuit board, there will be a group of control settings that will give the desired heat pattern. the operator must s e t t emperature s f o r s evera l h eatin g z ones , a n d a figure for belt speed. t aken together , these control settings make up a heating aprofileo for that particular circuit board. on m achine s c ontrolled b y a c ompute r, t h e c omputer remembers these profiles from one operating session to the next. figure 8 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. this profile will vary among soldering systems but it is a good starting point. factors that can af fect the profile include the type o f s olderin g s yste m i n u se , d ensit y a n d t ype s o f components on the board, type of solder used, and the type of board or substrate material being used. this profile shows temperature versus time. the line on the graph shows the actual temperature that might be experienced on the surface of a t es t b oar d a t o r n ea r a c entra l s olde r j oint . t h e t wo profiles are based on a high density and a low density board. the v itronics smd310 convection/infrared reflow soldering system was used to generate this profile. the type of solder used w a s 6 2/36/ 2 t i n l ea d s ilve r w it h a m eltin g p oint between 177 189 c. when this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. the components on the board are then heated by conduction. the circuit board, because it has a large surface area, a bsorb s t h e t herma l e nergy m or e e fficiently , t hen distributes this energy to the components. because of this effect, t h e m ai n b od y o f a c omponen t m a y b e u p t o 3 0 degrees cooler than the adjacent solder joints. step 1 preheat zone 1 arampo step 2 vent asoako step 3 heating zones 2 & 5 arampo step 4 heating zones 3 & 6 asoako step 5 heating zones 4 & 7 aspikeo step 6 vent step 7 cooling 200 c 150 c 100 c 50 c time (3 to 7 minutes total) t max solder is liquid for 40 to 80 seconds (depending on mass of assembly) 205 to 219 c peak at solder joint desired curve for low mass assemblies 100 c 150 c 160 c 140 c figure 1. typical solder heating profile desired curve for high mass assemblies 170 c motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability , including without limitation consequential or incidental damages. at ypicalo parameters can and do vary in dif ferent applications. all operating parameters, including at ypicalso must be validated for each customer application by customer ' s technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a situation where personal injury or death may occur . should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly , any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motorola and are registered trademarks of motorola, inc. motorola, inc. is an equal opportunity/af firmative action employer . free datasheet http:///
4 motorola smallsignal transistors, fets and diodes device data package dimensions style 6: pin 1. base 2. emitter 3. collector d j k l a c b s h g v 3 1 2 dim a min max min max millimeters 0.1102 0.1197 2.80 3.04 inches b 0.0472 0.0551 1.20 1.40 c 0.0350 0.0440 0.89 1.11 d 0.0150 0.0200 0.37 0.50 g 0.0701 0.0807 1.78 2.04 h 0.0005 0.0040 0.013 0.100 j 0.0034 0.0070 0.085 0.177 k 0.0180 0.0236 0.45 0.60 l 0.0350 0.0401 0.89 1.02 s 0.0830 0.0984 2.10 2.50 v 0.0177 0.0236 0.45 0.60 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. maxiumum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. case 31807 issue ad sot23 s g h d c b l a 1 3 2 j k dim a min max min max inches 2.70 3.10 0.1063 0.1220 millimeters b 1.30 1.70 0.0512 0.0669 c 1.00 1.30 0.0394 0.0511 d 0.35 0.50 0.0138 0.0196 g 1.70 2.10 0.0670 0.0826 h 0.013 0.100 0.0005 0.0040 j 0.10 0.26 0.0040 0.0102 k 0.20 0.60 0.0079 0.0236 l 1.25 1.65 0.0493 0.0649 s 2.50 3.00 0.0985 0.1181 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. case 318d03 issue e sc59 style 1: pin 1. emitter 2. base 3. collector how to reach us: usa / europe : motorola literature distribution; japan : nippon motorola ltd.; tatsumispdjldc, toshikatsu otsuki, p.o. box 20912; phoenix, arizona 85036. 18004412447 6f seibubutsuryucenter, 3142 tatsumi kotoku, tokyo 135, japan. 0335218315 mfax : rmf ax0@email.sps.mot.com t ouchtone (602) 2446609 hong kong : motorola semiconductors h.k. ltd.; 8b tai ping industrial park, internet : http://designnet.com 51 ting kok road, tai po, n.t., hong kong. 85226629298 mmbt1010lt1/d ? free datasheet http:///
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